Design e encapsulamento de acelerômetros piezoelétricos para dispositivos auditivos

On the design and packaging of píezoelectric accelerometers for hearing devices

Miron, Guilherme C. Engenharia Mecânica, Universidade Federal de Santa Catarina, Florianópolis, SC, Brasil, gcm.miron@gmail.com

Paul, Stephan Engenharia Mecânica, Universidade Federal de Santa Catarina, Florianópolis, SC, Brasil, stephan.paul@ufsc.br

Cordioli, Julio A. Engenharia Mecânica, Universidade Federal de Santa Catarina, Florianópolis, SC, Brasil, julio.cordioli@ufsc.br

Resumo

A deficiência auditiva afeta um grande número de pessoas em todo o mundo e pode ser tratada com diferentes tipos de dispositivos, como aparelhos auditivos e implantes cocleares. No entanto, seus componentes externos podem causar desconforto ao usuário. Os dispositivos auditivos totalmente implantáveis surgem como uma alternativa para permitir que o dispositivo auditivo seja totalmente implantado no corpo do paciente. Porém, projetar e fabricar um sensor capaz de atender a todos os requisitos para esses dispositivos ainda é um desafio. Este trabalho apresenta um estudo numérico do design e encapsulamento de um acelerômetro piezoelétrico MEMS otimizado para ser implantado na orelha média. Modelos numéricos 3D usando COMSOL Multiphysics foram construídos para prever a sensibilidade do dispositivo e calcular seu Equivalent Input Noise (EIN). Um desses modelos inclui uma cavidade de ar para simular a influência do ar aprisionado dentro do encapsulamento, permitindo incorporar amortecimento viscoso. Usando o modelo encapsulado, o campo de tensão, a vida em fadiga e os efeitos do amortecimento viscoso foram examinados e considerados para prever a faixa dinâmica dos sensores. Utilizando uma otimização focada na minimização do EIN, obteve-se um projeto de 2 mm x 2 mm e 1,5 mm x 1,5 mm para sensores MEMS. Esses designs apresentam desempenho excepcional em relação à relação sinal-ruído, com EIN comparável a um microfone condensador de eletreto normalmente usado em aparelhos auditivos tradicionais.

Palavras-chaves:

Acelerômetro

Piezoelétrico

Implante

Orelha

Dispositivo auditivo.

Abstract

Hearing impairment affects a large number of people worldwide and can be treated with different types of devices such as hearing aids and cochlear implants. Nevertheless, their external components can cause discomfort to the user. Totally implantable hearing devices come as an alternative allowing the hearing device to be completely implanted in the patient's body. However, designing and manufacturing a sensor capable of meeting all the requirements for these devices is still a challenge. This work presents a numerical study of the design and packaging of a MEMS piezoelectric accelerometer optimized to be implanted in the middle ear. 3D numerical models using COMSOL Multiphysics were built to predict the sensibility of the device and calculate its Equivalent Input Noise (EIN). One of those models include an air cavity to account for the influence of the air trapped in the packaging, allowing it to incorporate damping. Using the packaged model, the stress field, fatigue life and effects of viscous damping were examined and considered to predict the dynamic range of the sensors. Using an optimization focused on the minimization of the EIN, a 2 mm x 2 mm and a 1,5 mm x 1,5 mm design for MEMS sensors were obtained. Those designs exhibit exceptional performance in relation to signa-to-noise ratio, with EIN comparable to an electret condenser microphone usually used in traditional hearing devices.

Keywords:

Accelerometer

Piezoeletric

Implant

Hear

Hearing device.

Referências

[1] WHO. Adressing the rising prevalence of hearing loss. Technical report, World Health Organization (WHO), 2018. License: CC BY-NC-SA 3.0 IGO.

[2] Counter, P. Implantable hearing aids. Pro ceedings of the Institution of Mechanical Engine ers, Part H: Journal of Engineering in Medicine, 222(6):837–852, jun 2008. ISSN 0954-4119. doi: 10.1243/09544119JEIM365.

[3] Calero, Diego; Paul, Stephan; Gesing, André; Alves, Fabio e Cordioli, Júlio A. A technical review and evaluation of implantable sensors for hearing devices. BioMedical Engineering OnLine, 17(1):23, dec 2018. ISSN 1475-925X. doi: 10.1186/s12938-018-0454-z.

[4] Carlson, Matthew L; Pelosi, Stanley e Haynes, Da vid S. Historical Development of Active Middle Ear Implants. Otolaryngologic Clinics of North Ame rica, 47(6):893–914, dec 2014. ISSN 00306665. doi: 10.1016/j.otc.2014.08.004.

[5] Pulcherio, Janaina Oliveira Bentivi; Bittencourt, Aline Gomes; Burke, Patrick Rademaker; Monsanto, Rafael da Costa; Brito, Rubens; Tsuji, Robinson Koji e Bento, Ricardo Ferreira. Carina® and Esteem®: ASystematic Review of Fully Implantable Hearing Devices. PLoS ONE, 9(10):e110636, oct 2014. ISSN 1932-6203. doi: 10.1371/journal.pone.0110636.

[6] Jenkins, Herman A.; Atkins, James S.; Horlbeck, Drew; Hoffer, Michael E.; Balough, Ben; Arigo, Joseph V.; Alexiades, George e Garvis, William. U.S. Phase I preliminary results of use of the Otologics MET Fully-Implantable Ossicular Stimu lator. Otolaryngology- Head and Neck Sur gery, 137(2):206–212, aug 2007. ISSN 01945998. doi: 10.1016/j.otohns.2007.03.012.

[7] National Library of Medicine (U.S.). Feasibi lity study: A totally implantable cochlear implant (mi2000) for electrical stimulation of the auditory pathway of adults with severe to profound sensori neural hearing loss. Technical report, National Li brary of Medicine (U.S.), Setembro 2020. Identifier NCT04571333.

[8] Prochazka; Huber; Dobrev; Harris; Dalbert; Röösli; Obrist e Pfiffner. Packaging Technology for an Implantable Inner Ear MEMS Microphone. Sen sors, 19(20):4487, oct 2019. ISSN 1424-8220. doi: 10.3390/s19204487. Disponível em: https: //www.mdpi.com/1424-8220/19/20/4487.

[9] Zenner, Hans Peter e Leysieffer, Hans. Total im plantation of the implex TICA hearing amplifier im plant for high-frequency sensorineural hearing loss. Otolaryngologic Clinics of North America, 34(2):417 446, apr 2001. ISSN 00306665. doi: 10.1016/S0030 6665(05)70340-6.

[10] Sachse, M; Hortschitz, W; Stifter, M; Steiner, H e Sau ter, T. Design of an implantable seismic sensor placed on the ossicular chain. Medical Engineering & Phy sics, 35(10):1399–1405, oct 2013. ISSN 13504533. doi: 10.1016/j.medengphy.2013.03.012.

[11] Ko, Wen H.; Guo, J.; Xuesong Ye; Zhang, R.; Young, D. J. e Megerian, Cliff A. MEMS acoustic sensors for totally implantable hearing aid systems. Em 2008 IEEE International Symposium on Circuits and Sys tems, págs. 1812–1817. IEEE, may 2008. ISBN 978 1-4244-1683-7. doi: 10.1109/ISCAS.2008.4541792. Disponível em: http://ieeexplore.ieee.org/document/4 541792/.

[12] Ko, Wen H; Zhang, Rui; Huang, Ping; Guo, Jun; Ye, Xuesong; Young, Darrin J e Megerian, Cliff A. Stu dies of MEMS Acoustic Sensors as Implantable Mi crophones for Totally Implantable Hearing-Aid Sys tems. IEEE Transactions on Biomedical Circuits and Systems, 3(5):277–285, oct 2009. ISSN 1932-4545. doi: 10.1109/TBCAS.2009.2032267.

[13] Park, Woo Tae; Partridge, Aaron; Candler, Rob N.; Ayanoor-Vitikkate, Vipin; Yama, Gary; Lutz, Markus e Kenny, Thomas W. Encapsulated submillimeter piezoresistive accelerometers. Journal of Microe lectromechanical Systems, 15(3):507–514, jun 2006. ISSN 10577157. doi: 10.1109/JMEMS.2006.876648.

[14] Yip, Marcus; Jin, Rui; Nakajima, Hideko Heidi; Stan kovic, Konstantina M e Chandrakasan, Anantha P. A Fully-Implantable Cochlear Implant SoC With Piezo electric Middle-Ear Sensor and Arbitrary Waveform Neural Stimulation. IEEE Journal of Solid-State Cir cuits, 50(1):214–229, jan 2015. ISSN 0018-9200. doi: 10.1109/JSSC.2014.2355822.

[15] Gesing, Andre Loch; Masson, Zargos Neves; Arel lano, Diego Calero; Alves, Fabio; Paul, Stephan e Cordioli, Julio Apolinario. Middle Ear Ossicular Chain Vibration Detection by Means of an Optimized MEMSPiezoelectric Accelerometer. IEEE Sensors Journal, 19(6):2079–2086, mar 2019. ISSN 1530 437X. doi: 10.1109/JSEN.2018.2886043.

[16] Seong, KiWoong; Mun,HaJun; Shin, DongHo; Kim, Jong Hoon; Nakajima, Hideko Heidi; Puria, Sunil e Cho, Jin-Ho. A vibro-acoustic hybrid implantable microphone for middle ear hearing aids and cochlear implants. Sensors, 19(5), 2019. ISSN 1424-8220. doi: 10.3390/s19051117. Disponível em: https://ww w.mdpi.com/1424-8220/19/5/1117.

[17] Hake, Alison E.; Zhao, Chuming; Sung, Wang-Kyung e Grosh, Karl. Design and Experimental Assessment of Low-Noise Piezoelectric Microelectromechanical Systems Vibration Sensors. IEEE Sensors Journal, 21(16):17703–17711, aug 2021. ISSN 1530-437X. doi: 10.1109/JSEN.2021.3085825. Disponível em: https://ieeexplore.ieee.org/document/9446110/.

[18] Ilik, Bedirhan; Koyuncuo˘glu, Aziz; Sukas e Külah, Haluk. Thin film piezoelectric acoustic transducer for fully implantable cochlear implants. Sensors and Actuators A: Physical, 280:38–46, 2018. ISSN 0924 4247. doi: https://doi.org/10.1016/j.sna.2018.07.020. Disponível em: https://www.sciencedirect.com/scie nce/article/pii/S0924424718300827.

[19] Park, Woo-Tae; O’Connor, Kevin N.; Chen, Kuan Lin; Mallon, Joseph R; Maetani, Toshiki; Dalal, Par mita; Candler, Rob N; Ayanoor-Vitikkate, Vipin; Ro berson, Joseph B; Puria, Sunil e Kenny, Thomas W. Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids. Bio medical Microdevices, 9(6):939–949, dec 2007. ISSN 1387-2176. doi: 10.1007/s10544-007-9072-4.

[20] Jia, Xian-Hao; Gao, Na; Xu, Xin-da; Wu, Yong-Zhen; Kang, Hou-Yong e Chi, Fang-Lu. A new floating piezoelectric microphone for the implantable middle ear microphone in experimental studies. Acta Oto Laryngologica, 136(12):1248–1254, dec 2016. ISSN 0001-6489. doi: 10.1080/00016489.2016.1201590. Disponível em: https://www.tandfonline.com/doi/full /10.1080/00016489.2016.1201590.

[21] Calero, Diego; Lobato, Lucas; Paul, Stephan e Cor dioli, Júlio A. Analysis of the Human Middle Ear Dynamics Through Multibody Modeling. Journal of Biomechanical Engineering, 142(7), jul 2020. ISSN 0148-0731. doi: 10.1115/1.4046689.

[22] Kotzar, Geoffrey; Freas, Mark; Abel, Phillip; Fleisch man, Aaron; Roy, Shuvo; Zorman, Christian; Moran, James M e Melzak, Jeff. Evaluation of MEMS mate rials of construction for implantable medical devices. Biomaterials, 23(13):2737–2750, jul 2002. ISSN 01429612. doi: 10.1016/S0142-9612(02)00007-8.

[23] Ko, Wen H. Trends and frontiers of MEMS. Sensors and Actuators, A: Physical, 136(1):62–67, may 2007. ISSN 09244247. doi: 10.1016/j.sna.2007.02.001.

[24] Svatos, V; Pekarek, J; Dusek, D; Zak, J; Hadas, Z e Prasek, J. Design and Fabrication of Fully Implantable MEMS Cochlea. Procedia Engine ering, 100:1224–1231, 2015. ISSN 18777058. doi: 10.1016/j.proeng.2015.01.487. 25th DAAAM In ternational Symposium on Intelligent Manufacturing and Automation, 2014.

[25] Villarruel Mendoza, Luis Abelardo; Scilletta, Nata lia Antonela; Bellino, Martin Gonzalo; Desimone, Martin Federico e Catalano, Paolo Nicolas. Recent Advances in Micro-Electro-Mechanical Devices for Controlled Drug Release Applications. Frontiers in Bioengineering and Biotechnology, 8:827, jul 2020. ISSN 2296-4185. doi: 10.3389/fbioe.2020.00827.

[26] Gesing, A. L.; Alves, F. D. P.; Paul, S. e Cordioli, J. A. Onthe design of a MEMSpiezoelectric accelerometer coupled to the middle ear as an implantable sensor for hearing devices. Scientific Reports, 8(1):3920, dec 2018. ISSN 2045-2322. doi: 10.1038/s41598-018 22219-7.

[27] COMSOLMultiphysics. Introduction to comsol mul tiphysics®. COMSOL Multiphysics, Burlington, MA, accessed Feb, 9:2018, 1998.

[28] Tichý, Jan; Erhart, Jiˇ rí; Kittinger, Erwin e Pˇ rívratská, Jana. Fundamentals of Piezoelectric Sensorics. Ber lin, Heidelberg: Springer Berlin Heidelberg, 2010. ISBN 978-3-540-43966-0. doi: 10.1007/978-3-540 68427-5.

[29] Kim, Donghwan; Hewa-Kasakarage, Nishshanka N. e Hall, Neal A. A theoretical and experimental compari son of3-3 and3-1 modepiezoelectric microelectrome chanical systems (MEMS). Sensors and Actuators A: Physical, 219:112–122, nov 2014. ISSN 09244247. doi: 10.1016/j.sna.2014.08.006.

[30] Levinzon, F.A. Fundamental Noise Limit of Piezoe lectric Accelerometer. IEEE Sensors Journal, 4(1): 108–111, feb 2004. ISSN 1530-437X. doi: 10.1109/J SEN.2003.820366.

[31] Hussey, Bob e Wilson, Jo. Advanced Techni cal Ceramics Directory and Databook. Boston, MA: Springer US, 1998. ISBN 978-0-412-80310 9. doi: 10.1007/978-1-4419-8662-7.

[32] Izyumskaya, N.; Alivov, Y.-I.; Cho, S.-J.; Morkoç, H.; Lee, H. e Kang, Y.-S. Processing, Struc ture, Properties, and Applications of PZT Thin Films. Critical Reviews in Solid State and Materials Scien ces, 32(3-4):111–202, dec 2007. ISSN 1040-8436. doi: 10.1080/10408430701707347.

[33] Shilpa, G D; Sreelakshmi, K e Ananthaprasad, M G. PZT thin film deposition techniques, properties and its application in ultrasonic MEMS sensors: a review. IOP Conference Series: Materials Science and En gineering, 149:012190, sep 2016. ISSN 1757-8981. doi: 10.1088/1757-899X/149/1/012190.

[34] Sirohi, Jayant e Chopra, Inderjit. Fundamental Un derstanding of Piezoelectric Strain Sensors. Journal of Intelligent Material Systems and Structures, 11(4): 528–542, jun 1999. doi: 10.1117/12.350731.

[35] Barrow, D. A.; Petroff, T. E.; Tandon, R. P. e Sayer, M. Characterization of thick lead zirconate titanate films fabricated using a new sol gel based process. Journal of Applied Physics, 81(2):876–881, jan 1997. ISSN 0021-8979. doi: 10.1063/1.364172.

[36] Gardeniers, Johannes G.E.; Verholen, A.G.B.J.; Verholen, A.G.B.J.; Tas, Niels Roelof e Elwenspoek, Michael Curt. Direct measurement of piezoelectric properties of sol-gel pzt films. Journal of the Korean Physical Society, 32(32):S1573–S1577, 1998. ISSN 0374-4884.

[37] Luginbuhl, Ph; Racine, G.-A; Lerch, Ph; Roma nowicz, B; Brooks, K.G; Rooij, N.F; Renaud, Ph e Setter, N. Piezoelectric cantilever beams actuated by PZT sol-gel thin film. Sensors and Actuators A: Phy sical, 54(1-3):530–535, jun 1996. ISSN 09244247. doi: 10.1016/S0924-4247(95)01196-X.

[38] Tsaur, Jiunnjye; Wang, Zhan Jie; Zhang, Lulu; Ichiki, Masaaki; Wan, Jiang Wen e Maeda, Ryutaro. Pre paration and Application of Lead Zirconate Titanate (PZT) Films Deposited by Hybrid Process: Sol-Gel Method and Laser Ablation. Japanese Journal of Applied Physics, 41(Part 1, No. 11B):6664–6668, nov 2002. ISSN 0021-4922. doi: 10.1143/JJAP.41.6664.

[39] Park, Gun-Tae; Choi, Jong-Jin; Ryu, Jungho; Fan, Huiqing e Kim, Hyoun-Ee. Measurement of piezoe lectric coefficients of lead zirconate titanate thin films by strain-monitoring pneumatic loading method. Ap plied Physics Letters, 80(24):4606–4608, jun 2002. ISSN 0003-6951. doi: 10.1063/1.1487901.

[40] Hauke, T.; Beige, H.; Giersbach, M.; Seifert, S. e Sporn, D. Mechanical and electric fatigue of PZT(53/47) films on metallic substrates. Integra ted Ferroelectrics, 35(1-4):219–228, feb 2001. ISSN 1058-4587. doi: 10.1080/10584580108016903.

[41] Marghitu, Dan B.; Diaconescu, Cristian I. e Ciocirlan, Bogdan O. Mechanics of Materials. Em Mechanical Engineer’s Handbook, págs. 119–188. Elsevier, 2001. doi: 10.1016/B978-012471370-3/50004-8.

[42] Butler, John L.; Rolt, Kenneth D. e Tito, Frank A. Piezoelectric ceramic mechanical and electrical stress study. The Journal of the Acoustical Society of Ame rica, 96(3):1914–1917, sep 1994. ISSN 0001-4966. doi: 10.1121/1.410205.

[43] Shepard, J. F.; Chu, F.; Xu, B. e Trolier-McKinstry, S. The Effects of Film Thickness and Texture on the high andLow-Fieldstress Response of LeadZirconate Titanate Thin Films. MRS Proceedings, 493:81, feb 1997. ISSN 0272-9172. doi: 10.1557/PROC-493-81.

[44] Chuang, Tze-jer; Wang, Zhengdong; Hill, Michael e White, Grady. Fatigue Life Predictions of PZT Using Continuum Damage Mechanics and Finite Element Methods. Em Bradt, R C; Hasselman, D P H; Munz, D; Sakai, M e Shevchenko, V Ya., editores, Fracture Mechanics of Ceramics, págs. 135–148. Springer US, Boston, MA, 1996. ISBN 978-1-4615-5853-8. doi: 10.1007/978-1-4615-5853-8_10.

[45] Mazzalai, Andrea; Balma, Davide; Chidambaram, Nachiappan; Matloub, Ramin e Muralt, Paul. Characterization and Fatigue of the Converse Piezoelectric Effect in PZT Films for MEMS Applications. Jour nal of Microelectromechanical Systems, 24(4):831 838, aug 2015. ISSN 1057-7157. doi: 10.1109/J MEMS.2014.2353855.

[46] Jones, Jacob L.; Salz, Christopher R. J. e Hoff man, Mark. Ferroelastic Fatigue of a Soft PZT Ceramic. Journal of the American Ceramic Soci ety, 88(10):2788–2792, oct 2005. ISSN 0002-7820. doi: 10.1111/j.1551-2916.2005.00520.x.

[47] Nishihara, Shinsei; Aritomo, Hiroshi e Goode, Ri chard L. Effect of Changes in Mass on Middle Ear Function. Otolaryngology–Head and Neck Sur gery, 109(5):899–910, nov 1993. ISSN 0194-5998. doi: 10.1177/019459989310900520.

[48] Buehren, Markus. Differential Evolution, 2014.

[49] Arora, Jasbir. Introduction to optimum design (fourth edition). San Diego, CA: Academic Press, 2016. ISBN 9780128009185.

[50] Schuettler, M e Stieglitz, T. Microassembly and micropackaging of implantable systems. Em In mann, Andreas e Hodgins, Diana, editores, Implan table Sensor Systems for Medical Applications, Wo odhead Publishing Series in Biomaterials, págs. 108 149. Elsevier, 2013. ISBN 978-1-84569-987-1. doi: 10.1533/9780857096289.1.108.

[51] Dixit, Pradeep e Henttinen, Kimmo. Via Technolo gies for MEMS. Em Tilli, Markku; Motooka, Teru aki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto Kröckel, Mervi e Lindroos, Veikko, editores, Hand book of Silicon Based MEMS Materials and Techno logies, Micro and Nano Technologies, págs. 694–712. Elsevier, Boston, second edia ed., 2015. ISBN 978 0-323-29965-7. doi: 10.1016/B978-0-323-29965 7.00038-5.

[52] Hosaka, H; Itao, K e Kuroda, S. Evaluation of energy dissipation mechanisms in vibrational micro actuators. Em Proceedings IEEE Micro Electro Me chanical Systems An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems, págs. 193–198. IEEE, 1994. ISBN 0-7803-1833-1. doi: 10.1109/MEMSYS.1994.555622.

[53] McLaughlin, J.C. e Willoughby, A.F.W. Fracture of silicon wafers. Journal of Crystal Growth, 85(1-2):83 90, nov 1987. ISSN 00220248. doi: 10.1016/0022 0248(87)90207-7.

[54] Hooker, Matthew W. Properties of pzt-based piezo electric ceramics between-150 and 250c. Technical report, National Aeronautics and Space Administra tion (NASA), 1998.

[55] Knowles. MEMS Microphone, MM20-33366-000 Datasheet, sept. 2019.